BGA Rework Station SD-620

Manufacturer	SD
Model	620

● Independent three-temperature zone temperature control system.

①The upper and lower temperature zones are heated by hot air, and the IR preheating zone is heated by infrared, and the temperature is precisely controlled at ±1℃. The upper and lower temperature zones can be heated from the top of the components and the bottom of the PCB at the same time, and 8 temperature control stages can be set at the same time, so that the PCB board can be heated evenly. The bottom of the large IR is preheated to make the whole PCB evenly heated to prevent deformation and ensure the soldering effect, and the heating board can control the heating independently.

② The BGA chip and PCB board can be partially heated by hot air at the same time, and then supplemented by a large area of IR heater to preheat the bottom of the PCB board, which can completely avoid the deformation of the PCB board during the reworking process; by selecting the upper temperature zone or lower temperature zone can be used alone, and the energy of the upper and lower heaters can be freely combined.

③ Select high-precision K-type thermocouple closed-loop control and PID parameter self-tuning system; can simultaneously display four temperature curves and store multiple groups of user data, and has the function of instantaneous curve analysis; external temperature measurement interface to achieve precision detection of the temperature, the actual temperature curve of the collected BGA can be analyzed and calibrated at any time. and the curve analysis, setting and correction of temperature parameters can be performed on the touch screen at any time.

●Precise optical alignment system: Adopt high-definition adjustable CCD color optical alignment system with spectroscopy, magnification, reduction, and auto-focus functions, and automatic chromatic aberration resolution and brightness adjustment device to adjust imaging clarity; with 15" high-definition LCD monitor.

● Multi-functional and humanized operating system

①High-definition touch screen human-machine interface, integrated design of upper heating device and mounting head. Equipped with various specifications of titanium alloy BGA nozzle, which can be rotated 360° at will, easy to install and replace.

② Micrometer fine adjustment for X, Y-axis and R-angle, precise alignment, accuracy up to ±0.01mm.

● Superior functions.

① With 5 working modes: disassembly, soldering, placement, semi-automatic and manual five modes.

② Percentage air speed adjustment, fan speed and chip temperature curve are saved at the same time.

③ Gear and rack drive the upper heating head, long time rotation gear and rack will not strain, the same industry are using belt driven upper heating head, long time rotation, easy to damage.

Total Power	4800W
Upper Heating Power	800W
Lower Heating Power	1200W
Lower Infrared Heating Power	2700W(1200W controlled)
Power Supply	Single Phase(Single Phase) AC 220V±10 50Hz
Positioning Method	V-shaped slot + universal fixture + laser positioning lamp for quick positioning.
Temperature control	High precision K-type thermocouple (Ksensor) closed loop control (Closed Loop), independent temperature measurement up and down，temperature accuracy up to ±2 degrees.
Electrical options	Highly sensitive touch screen + temperature control module + PLC + stepper drive
Maximum PCB size	470×380mm
Minimum PCB size	10×10mm
Number of temperature measurement interface	1
Chip magnification	2-32 times
PCB thickness	0.5-8mm
Applicable chip	0.8mm-5cm
Minimum chip pitch	0.15mm
Maximum load	500G
Mounting accuracy	±0.01mm
Dimension	L650×W630×H850mm
Weight	Net weight 60kg

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SD-630 BGA Rework Station

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