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High Precision Manual Printing Table Product Manual

Manufacturer
SD
Model
High precision manual printing table is mainly designed for single and double-sided circuit board solder paste or red glue printing requirements, the work platform selection of high-quality aluminum honeycomb positioning hole processing, the base using thickened steel plate welding molding, strong and stable, durable. Its features are as follows:
(1)The line plate is positioned by positioning pins, fixed rods and fixed plate blocks, which is convenient for positioning and ensures repeatable operation accuracy.

(2)The calibration method is easy and fast by moving the stencil and combining with the X and Y axis fine adjustment correction of the printing platform.

(3)The stencil holder adopts a spiral screw, which can adjust the height up and down, so it is convenient to control the PCB thickness and the amount of printing solder paste.

(4)Printing stencil is fixed by 4 knobs with pressure plate, fast and firm.

Model

SD-

Workbench size

300*400mm

Maximum printing size

250*400mm

Maximum mesh frame size

370*470mm

Printing speed

Manual control

Other specifications can be customized by contacting our company

Thickness of printed material

0-80mm

Table vertical and horizontal adjustment

10mm

Printing platform height

220mm

Repetition accuracy

±0.01mm

Positioning method

Profile or reference hole

Dimension (L*W*H)

540*370*350mm

Weight

36KG

Manual printing table debugging method: Check whether the steel template is clean, if there is solder paste or other solid substance residue, use alcohol, towel will remain on the steel template debris clean; Check whether the solder hardness is moderate. Detection method: Select the element with dense pins on the steel template, scrape the solder paste on the test plate (P C B board or paper), observe whether the solder paste can all leak through the steel template and evenly distributed on the test plate, if there is leakage or incomplete phenomenon, the solder paste hardness should be adjusted until the solder paste hardness is appropriate; Adjust the solder paste method: use tweezers or sheet plate directly mix, add a little thinner to the solder paste, mix with tweezers or sheet plate.
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