BGA Rework Station Model: SD-800

Manufacturer	SD
Model	800

1. The integration design of hot air head and mounting head, with automatic mounting automatic welding and automatic removal function.

2. The upper air head adopts hot air system, heating up fast, temperature uniformity, cooling fast (can suddenly drop 50-80 degrees when cooling down), to better meet the process requirements of lead-free welding. Lower heat temperature zone are using infrared + hot air mixed heating, infrared direct action on the heating area, and hot air conduction at the same time, which can make up for the mutual shortcomings, so that the PCB heating fast (heating rate of 10 ℃ / S), while still maintaining a uniform temperature;.

3. Independent three temperature zones (upper temperature zone, lower temperature zone, infrared preheating zone), the upper temperature zone and lower temperature zone to achieve synchronous automatic movement, can automatically reach the bottom of the infrared preheating zone in any position. The lower temperature zone can be moved up and down to support the PCB, which is automatically controlled by motor. To realize the PCB in the fixture does not move, the upper and lower heating head can move to the target chip of the PCB in one piece.

4. PCB cardboard adopts high precision slider to ensure the accuracy of BGA and PCB board placement;

5. The original bottom preheating platform, using Germany imported excellent heating materials (infrared gold-plated light tube) + anti-dazzle constant temperature glass (temperature resistance up to 1800 ℃) preheating area of 500 * 420mm;

6. Preheating platform, plywood device and cooling system can be moved in X direction as a whole. PCB positioning, folding and welding safer and more convenient.

7. X, Y using automatic motor control of movement, so that alignment is fast and convenient, equipment space is fully utilized, with a relatively small equipment volume to achieve a large area of PCB rework, the maximum clamping board size up to 510 * 480mm, no rework dead space.

8. Double rocker control, alignment lens and upper and lower heating platform, thus ensuring alignment accuracy.

9. Built-in vacuum pump, φ angle rotation, precision fine-tuning placement nozzle.

10. Automatic nozzle recognition suction material and mounting height, pressure can be controlled within 10 grams tiny range, with 0 pressure suction material, mounting function, for smaller chips.

11. Color optical vision system with manual X, Y direction movement, with dichroic, magnification and fine-tuning function, including chromatic aberration resolution device, auto-focus, software operation function, can rework maximum BGA size 80*80 mm.

12. A variety of sizes of alloy hot air nozzle, easy to replace, can be rotated 360 ° positioning.

13. Equipped with 5 temperature measurement ports, with multi-point real-time temperature monitoring and analysis function.

14. With solid-state operation display function, so that the temperature control is more safe and reliable.

15. The machine can automatically generate SMT standard temperature disassembly curve in different regions under different environmental temperatures, without manual setting of the machine curve, experienced operators can use, to achieve machine intelligence.

16. With a camera to observe the melting point of the side of the tin ball, easy to determine the curve (this function is optional).

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Total power	7600W
Upper heating power	1200W
Lower heating power	1200W
Infrared heating power	5000W (2000W controlled)
Power Supply	Two-phase 220V, 50/60Hz
Positioning method	V-shaped slot to fix PCB, laser positioning lamp for quick positioning, motor can be operated by rocker to move X, Y axis at will.
The number of drive motors and control area	6 (split edge control equipment heating head X, Y-axis movement, alignment lens X, Y-axis movement, the second temperature zone heating head Z1 electric lift, the upper heating head Z-axis up and down movement.
Whether the upper and lower heating heads can be moved as a whole	Yes (motorized movement)
Whether the alignment lens can be automatically	Yes (automatic movement or manually controlled movement)
Whether the equipment with suction feeding device	Yes (standard)
The third temperature zone heating (preheating) mode	The use of German imports of infrared heating light tube (advantage: heating fast, the equipment is normally heated, the temperature around the PCB main board and the temperature of the reworked chip position will not form a large temperature difference, to ensure that the PCB main board will not be deformed or distorted phenomenon, can better improve the chip welding yield)
The second temperature zone control mode	Electric automatic lifting
Temperature control	High-precision K-type thermocouple (K-sensor) closed-loop control (Closed Loop), the upper and lower independent temperature measurement, temperature control accuracy of ± 1 degree.
Electrical options	Taiwan touch screen + high precision temperature control module + Panasonic PLC + Panasonic servo + stepper drive
Maximum PCB size	630*480mm (actual effective area, no dead space for repair)
Minimum PCB size	10*10mm
Number of temperature measurement interface	5
Chip enlargement and reduction range	2-50 times
PCB thickness	0.5~8mm
Applicable chips	0.80.8~8080mm
Minimum chip pitch	0.15mm
Maximum loading capacity	800g
Mounting accuracy	±0.01mm
Machine size	L970W700H830mm
Machine weight	Approx. 140KG

BGA Rework Station Model: SD-750

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