BGA Rework Station SD-850

Manufacturer	SD
Model	850

Integrated design of hot air head and placement head, with automatic placement, automatic welding and automatic disassembly functions.
The hot air system is adopted in the upper part of the limelight, with fast heating, uniform temperature and fast cooling, which can better meet the technical requirements of lead-free soldering. The lower heating zone is heated by infrared + hot air mixture. The infrared rays directly act on the heating area and conduct with the hot air at the same time. This can make up for the mutual deficiency and make the PCB heat up quickly while maintaining a uniform temperature.
Independent three temperature zones (upper temperature zone, lower temperature zone, infrared preheating zone), the upper temperature zone and the lower temperature zone realize synchronous automatic movement, and can automatically reach any position in the bottom infrared preheating zone. The lower temperature zone can move up and down to support the PCB, and is automatically controlled by a motor. Realize that the PCB does not move on the fixture, and the upper and lower heating heads can move to the target chip of the PCB as a whole.
The PCB card board adopts high-precision sliders to ensure the placement accuracy of BGA and PCB boards.
The original bottom preheating platform adopts excellent heating materials imported from Germany + anti-glare constant temperature glass with a preheating area of 500*420mm.
The preheating platform, splint device and cooling system can move in the X direction as a whole. Make PCB positioning, folding and soldering safer and more convenient.
X, Y use the motor automatic control movement mode, which makes the alignment fast and convenient, and the equipment space is fully utilized. The relatively small equipment volume realizes super large-area PCB rework. The maximum splint size can reach 510*480mm, and there is no dead angle for rework. ;
Double joystick control, alignment lens and upper and lower heating platforms to ensure alignment accuracy;
Built-in vacuum pump, φ angle rotation, fine-tuning placement nozzle;
The suction nozzle automatically recognizes the suction and placement height, and the pressure can be controlled within a small range of 10 grams. It has the function of 0-pressure suction and placement, and is aimed at smaller chips;
Color optical vision system with manual X, Y direction movement, spectroscopic two-color, magnification and fine-tuning functions, including color difference resolution device, auto-focus, software operation function, and the maximum BGA size that can be repaired is 80*80 mm;
Alloy hot air nozzles of various sizes are easy to replace and can be rotated and positioned by 360°;
Equipped with 5 temperature measurement ports, with multi-point real-time temperature monitoring and analysis functions;
It has the function of solid-state operation display, which makes the temperature control more safe and reliable; it has the function of nitrogen distribution;
The machine can automatically generate SMT standard temperature disassembly curves at different ambient temperatures in different regions, without manual setting of machine curves, and can be used by operators with or without experience, realizing machine intelligence;
With a camera for observing the melting point on the side of the solder ball, it is convenient to determine the curve (this function is optional).

Total power	8400W
Upper heating power	1600W
Lower heating power	1600W
Infrared heating power	5000W (2000W controlled)
Power Supply	Two-phase 220V, 50/60Hz
Optical Alignment System	Industrial 8 million HDMI HD camera
Positioning method	V-shaped slot to fix PCB, laser positioning lamp for quick positioning, motor can be operated by rocker to move X, Y axis at will.
The number of drive motors and control area	6 (X, Y axis movement of the heating head of the edge control equipment, X, Y axis movement of the alignment lens, electric lifting of the heating head Z1 in the second temperature zone, and Z axis movement of the upper heating head;
Whether the preheating area of the third temperature zone can be moved	Yes (motorized movement)
Whether the upper and lower heating heads can be moved as a whole	Yes (motorized movement)
Whether the alignment lens can be automatically	Yes (automatic movement or manually controlled movement)
Whether the equipment with suction feeding device	Yes (standard)
The third temperature zone heating (preheating) mode	Adopt bright infrared heating light tube imported from Germany (advantages: fast heating, when the equipment is heated normally, the temperature around the PCB motherboard and the temperature of the chip to be repaired will not form a large temperature difference, so as to ensure that the PCB motherboard will not be deformed or twisted phenomenon, which can better improve the soldering yield of the chip)
The second temperature zone control mode	Electric automatic lifting
Temperature control	High-precision K-type thermocouple (K-sensor) closed-loop control (Closed Loop), the upper and lower independent temperature measurement, temperature control accuracy of ± 1 degree.
Electrical options	Screen pass touch screen + Panasonic PLC + Dalian University of Technology temperature control module + Panasonic servo + stepping driver
Maximum PCB size	680*550mm (actual effective area, no dead angle for repair)
Minimum PCB size	10*10mm
Number of temperature measurement interface	5
Chip enlargement and reduction range	2-100 times
PCB thickness	0.5~8mm
Applicable chips	0.30.6mm-9090mm
Minimum chip pitch	0.15mm
Maximum loading capacity	800g
Mounting accuracy	±0.01mm
Machine size	L1070W800H1700mm
Machine weight	Approx. 200KG

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